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never stop thinking. hyb18t1g400af hyb18t1g800af hyb18t1g160af 1-gbit double-data-rate-two sdram ddr2 sdram rohs compliant products data sheet, rev. 1.02, nov. 2004 memory products
the information in this document is subject to change without notice. edition 2004-11 published by infineon technologies ag, st.-martin-strasse 53, 81669 mnchen, germany ? infineon technologies ag 2004. all rights reserved. attention please! the information herein is given to describe certain comp onents and shall not be considered as a guarantee of characteristics. terms of delivery and rights to technical change reserved. we hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. information for further information on technology, delivery terms and conditions and prices please contact your nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contain da ngerous substances. for information on the types in question please contact your near est infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the hu man body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. never stop thinking. hyb18t1g400af hyb18t1g800af hyb18t1g160af 1-gbit double-data-rate-two sdram ddr2 sdram rohs compliant products data sheet, rev. 1.02, nov. 2004 memory products template: mp_a4_v2.3_2004-01-14.fm hyb18t1g[40/80/16]0af?[3.7/5] revision history: 2004-11 rev. 1.02 previous version: 2004-03-24 (v1.0) page subjects (major changes since last revision) all document contains final currents all document contains green products only we listen to your comments any information within this document that yo u feel is wrong, unclear or missing at all? your feedback will help us to continuous ly improve the qualit y of this document. please send your proposal (including a reference to this document) to: techdoc.mp@infineon.com hyb18t1g[40/80/16]0af?[3.7/5] 1-gbit double-data-rate-two sdram data sheet 5 rev. 1.02, 2004-11 09112003-7yzf-nh5g 1 overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.2 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.3 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.4 pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 1.5 1gbit ddr2 addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 1.6 input/output functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 1.7 block diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2 functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.1 simplified state diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.2 basic functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.2.1 power on and initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.2.2 programming the mode register and extended mode registers . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2.2.2.1 ddr2 sdram mode register set (mrs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 2.2.3 ddr2 sdram extended mode register set (emrs(1)) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 2.2.3.1 emr(2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2.2.3.2 emr(3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 2.3 off-chip driver (ocd) impedance adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 2.4 on-die termination (odt) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 2.5 bank activate command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 2.6 read and write commands and access modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 2.6.1 posted cas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 2.6.2 burst mode operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 2.6.3 read command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 2.6.4 write command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 2.6.5 write data mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 2.6.6 burst interruption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 2.7 precharge command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 2.7.1 read operation followed by a precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 2.7.2 write followed by precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 2.8 auto-precharge operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 2.8.1 read with auto-precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 2.8.2 write with auto-precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 2.8.3 read or write to precharge command spacing summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 2.8.4 concurrent auto-precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 2.9 refresh . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 2.9.1 auto-refresh command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 2.9.2 self-refresh command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 2.10 power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 2.11 other commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 2.11.1 no operation command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 2.11.2 deselect command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 2.12 input clock frequency change . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 2.13 asynchronous cke low reset event . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 3 truth tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 4 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 5 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 5.1 dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 5.2 dc & ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 5.3 output buffer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 5.4 default output v-i characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 table of contents hyb18t1g[40/80/16]0af?[3.7/5] 1-gbit double-data-rate-two sdram data sheet 6 rev. 1.02, 2004-11 09112003-7yzf-nh5g 5.4.1 calibrated output driver v-i characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 5.5 input / output capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 5.6 power & ground clamp v-i characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 5.7 overshoot and undershoot specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 6 i dd specifications and conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 6.1 i dd test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 6.2 on die termination (odt) current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 7 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 8 ac timing measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 8.1 reference load for timing measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 8.2 slew rate measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 8.2.1 output slew rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 8.2.2 input slew rate - differential signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 8.3 input and data setup and hold time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 8.3.1 definition for input setup ( t is ) and hold time ( t ih ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 8.3.2 definition for data setup ( t ds ) and hold time ( t dh ), differential data strobes . . . . . . . . . . . . . . . . 87 8.3.3 definition for data setup ( t ds1 ) and hold time ( t dh1 ), single-ended data strobes . . . . . . . . . . . . . 88 8.3.4 slew rate definition for input and data setup and hold times . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 8.3.5 setup ( t is ) and hold ( t ih ) time derating tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 9 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 10 ddr2 component nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 table of contents hyb18t1g[40/80/16]0af?[3.7/5] 1-gbit double-data-rate-two sdram overview data sheet 7 rev. 1.02, 2004-11 09112003-7yzf-nh5g 1overview this chapter gives an overview of the 1-gbit double -data-rate-two sdram product family and describes its main characteristics. 1.1 features the 1-gbit double-data-rate-two sdram offers the following key features: ? 1.8 v 0.1 v power supply 1.8 v 0.1 v (sstl_18) compatible i/o dram organisations with 4, 8 and 16 data in/outputs double data rate architecture: two data transfers per clock cycle, eight internal banks for concurrent operation cas latency: 3, 4 and 5 burst length: 4 and 8 differential clock inputs (ck and ck ) bi-directional, differential data strobes (dqs and dqs ) are transmitted / received with data. edge aligned with read data and center-aligned with write data. dll aligns dq and dqs transitions with clock dqs can be disabled for single-ended data strobe operation commands entered on each positive clock edge, data and data mask are referenced to both edges of dqs data masks (dm) for write data posted cas by programmable additive latency for better command and data bus efficiency off-chip-driver impedance adjustment (ocd) and on-die-termination (odt) for better signal quality. auto-precharge operation for read and write bursts auto-refresh, self-refresh and power saving power-down modes average refresh period 7.8 s at a t case lower than 85 c, 3.9 s between 85 c and 95 c strong and weak strength data-output drivers 1k page size for 4 & 8, 2k page size for 16 packages: p-tfbga-68 for 4 & 8 components p-tfbga-92 for 16 components rohs compliant products 1) 1) rohs compliant product: restriction of the use of certai n hazardous substances (rohs) in electrical and electronic equipment as defined in the directive 2002/95/ec issued by the european parliament and of the council of 27 january 2003. these substances include merc ury, lead, cadmium, hexavalent chro mium, polybrominated biphenyls and polybrominated biphenyl ethers. table 1 high performance product type speed code ?3.7 ?5 unit speed grade ddr2?533 4?4?4 ddr2?400 3?3?3 ? max. clock frequency @cl5 f ck5 266 200 mhz @cl4 f ck4 266 200 mhz @cl3 f ck3 200 200 mhz min. ras-cas-delay t rcd 15 15 ns min. row precharge time t rp 15 15 ns min. row active time t ras 45 40 ns min. row cycle time t rc 60 55 ns hyb18t1g[40/80/16]0af?[3.7/5] 1-gbit double-data-rate-two sdram overview data sheet 8 rev. 1.02, 2004-11 09112003-7yzf-nh5g 1.2 description the 1-gb ddr2 dram is a high-speed double-data- rate-2 cmos synchronous dram device containing 1,073,741,824 bits and internally configured as an octal-bank dram. the 1-gb device is organized as either 32 mbit 4 i/o 8 banks, 16 mbit 8 i/o 8 banks or 8 mbit 16 i/o 8 banks chip. these synchronous devices achieve high speed transfer rates starting at 400 mb/sec/pin for general applications. see table 1 for performance figures. the device is designed to comply with all ddr2 dram key features: 1. posted cas with additive latency, 2. write latency = read latency - 1, 3. normal and weak strength data-output driver, 4. off-chip driver (ocd ) impedance adjustment 5. on-die terminatio n (odt) function. all of the control and address inputs are synchronized with a pair of externally supplied differential clocks. inputs are latched at the cross point of differential clocks (ck rising and ck falling). all i/os are synchronized with a single ended dqs or differential dqs-dqs pair in a source synchronous fashion. a 17 bit address bus for 4 and 8 organised components and a 16 bit address bus for 16 components is used to convey row, column and bank address information in a ra s-cas multiplexing style. the ddr2 device operates with a 1.8 v 0.1 v power supply. an auto-refresh and self-refresh mode is provided along with various power-saving power-down modes. the functionality described and the timing specifications included in this data sheet are for the dll enabled mode of operation. the ddr2 sdram is available in p-tfbga package. 1.3 ordering information note: for product nomenclature see chapter 10 of this data sheet table 2 ordering information for rohs compliant products part number org. speed cas 1) -rcd 2) -rp 3) latencies 1) cas: column adress strobe 2) rcd: row column delay 3) rp: row precharge clock (mhz) cas 1) -rcd 2) -rp 3) latencies clock (mhz) package hyb18t1g400af?5 x4 ddr2?400 3?3?3 200 ? ? p-tfbga-68 hyb18t1g800af?5 x8 hyb18t1g160af?5 x16 p-tfbga-92 hyb18t1g400af?3.7 x4 ddr2?533 4?4?4 266 3?3?3 200 p-tfbga-68 hyb18t1g800af?3.7 x8 hyb18t1g160af?3.7 x16 p-tfbga-92 hyb18t1g[40/80/16]0af?[3.7/5] 1-gbit double-data-rate-two sdram overview data sheet 9 rev. 1.02, 2004-11 09112003-7yzf-nh5g 1.4 pin configuration the pin configuration of a ddr2 s dram is listed by function in table 3 . the abbreviations used in the pin#/buffer type columns are explained in table 4 and table 5 respectively. the pin numbering for the fbga package is depicted in figure 1 for 4, figure 2 for 8 and figure 3 for 16 . table 3 pin configuration of ddr sdram ball#/pin# name pin type buffer type function clock signals 4/ 8 organizations j8 ck i sstl clock signal k8 ck i sstl complementary clock signal k2 cke i sstl clock enable clock signals 16 organization m8 ck i sstl clock signal n8 ck i sstl complementary clock signal n2 cke i sstl clock enable control signals 4/ 8 organizations k7 ras i sstl row address strobe l7 cas i sstl column address strobe k3 we i sstl write enable l8 cs i sstl chip select control signals 16 organization n7 ras i sstl row address strobe p7 cas i sstl column address strobe n3 we i sstl write enable p8 cs i sstl chip select address signals 4/ 8 organizations l2 ba0 i sstl bank address bus 2:0 l3 ba1 i sstl l1 ba2 i sstl m8 a0 i sstl address signal 12:0 m3 a1 i sstl m7 a2 i sstl n2 a3 i sstl n8 a4 i sstl n3 a5 i sstl n7 a6 i sstl p2 a7 i sstl p8 a8 i sstl p3 a9 i sstl m2 a10 i sstl ap i sstl p7 a11 i sstl r2 a12 i sstl hyb18t1g[40/80/16]0af?[3.7/5] 1-gbit double-data-rate-two sdram overview data sheet 10 rev. 1.02, 2004-11 09112003-7yzf-nh5g r8 a13 i sstl address signal 13 address signals 16 organization p2 ba0 i sstl bank address bus 2:0 p3 ba1 i sstl p1 ba2 i sstl r8 a0 i sstl address signal 12:0 r3 a1 i sstl r7 a2 i sstl t2 a3 i sstl t8 a4 i sstl t3 a5 i sstl t7 a6 i sstl u2 a7 i sstl u8 a8 i sstl u3 a9 i sstl r2 a10 i sstl ap i sstl u7 a11 i sstl v2 a12 i sstl data signals 4/ 8 organizations g8 dq0 i/o sstl data signal 0 g2 dq1 i/o sstl data signal 1 h7 dq2 i/o sstl data signal 2 h3 dq3 i/o sstl data signal 3 data signals 8 organization h1 dq4 i/o sstl data signal 4 h9 dq5 i/o sstl data signal 5 f1 dq6 i/o sstl data signal 6 f9 dq7 i/o sstl data signal 7 data signals 16 organization k8 dq0 i/o sstl data signal 0 k2 dq1 i/o sstl data signal 1 l7 dq2 i/o sstl data signal 2 l3 dq3 i/o sstl data signal 3 l1 dq4 i/o sstl data signal 4 l9 dq5 i/o sstl data signal 5 j1 dq6 i/o sstl data signal 6 j9 dq7 i/o sstl data signal 7 f8 dq8 i/o sstl data signal 8 f2 dq9 i/o sstl data signal 9 table 3 pin configuration of ddr sdram ball#/pin# name pin type buffer type function hyb18t1g[40/80/16]0af?[3.7/5] 1-gbit double-data-rate-two sdram overview data sheet 11 rev. 1.02, 2004-11 09112003-7yzf-nh5g g7 dq10 i/o sstl data signal 10 g3 dq11 i/o sstl data signal 11 g1 dq12 i/o sstl data signal 12 g9 dq13 i/o sstl data signal 13 e1 dq14 i/o sstl data signal 14 e9 dq15 i/o sstl data signal 15 data strobe 4 / 8 organisations f7 dqs i/o sstl data strobe e8 dqs i/o sstl data strobe data strobe 8 organisations f3 rdqs i/o sstl read data strobe e2 rdqs i/o sstl read data strobe data strobe 16 organization e7 udqs i/o sstl data strobe upper byte d8 udqs i/o sstl data strobe upper byte j7 ldqs i/o sstl data strobe lower byte h8 ldqs i/o sstl data strobe lower byte data mask 4 / 8 organizations e3 dm i sstl data mask data mask 16 organization f3 udm i sstl data mask upper byte j3 ldm i sstl data mask lower byte power supplies 4/ 8 organizations e9,g1,g3,g7, g9 v ddq pwr ? i/o driver power supply e1,j9,m9,r1 v dd pwr ? power supply e7,f2,f8,h2, h8 v ssq pwr ? power supply e3,j3;n1,p9 v ss pwr ? power supply j2 v ref ai ? i/o reference voltage j1 v ddl pwr ? power supply j7 v ssdl pwr ? power supply power supplies 16 organization j2 v ref ai ? i/o reference voltage e9, g1, g3, g7, g9 v ddq pwr ? i/o driver power supply m1 v ddl pwr ? power supply d1,h1,m9,r9, v1 v dd pwr ? power supply table 3 pin configuration of ddr sdram ball#/pin# name pin type buffer type function hyb18t1g[40/80/16]0af?[3.7/5] 1-gbit double-data-rate-two sdram overview data sheet 12 rev. 1.02, 2004-11 09112003-7yzf-nh5g d7,e2,g2,e8, g8,h7,j2,j8,l 2,l8 v ssq pwr ? power supply m7 v ssdl pwr ? power supply d3,h3,m3,t1, u9 v ss pwr ? power supply not connected 4 organization a1,a2,a8,a9, e2,f9,h1,f1, r7,h9,w1,w2 ,w8,w9,r3 nc nc ? not connected not connected 8 organization a1,a2,a8,a9, r7,w2,w3,w 8,w9,r3 nc nc ? not connected not connected 16 organization a1,a2,a8,a9, d2,h2,v3,v7, v8,aa1,aa2,a a8,aa9 nc nc ? not connected other pins 4/ 8 organizations k9 odt i sstl on-die termination control other pins 16 organization n9 odt i sstl on-die termination control table 4 abbreviations for pin type abbreviation description i standard input-only pin. digital levels. o output. digital levels. i/o i/o is a bidirectional input/output signal. ai input. analog levels. pwr power gnd ground nc not connected table 5 abbreviations for buffer type abbreviation description sstl serial stub terminated logic (sstl_18) lv-cmos low voltage cmos cmos cmos levels od open drain. the corresponding pin has 2 operational states, active low and tristate, and allows multiple devices to share as a wire-or. table 3 pin configuration of ddr sdram ball#/pin# name pin type buffer type function hyb18t1g[40/80/16]0af?[3.7/5] 1-gbit double-data-rate-two sdram overview data sheet 13 rev. 1.02, 2004-11 09112003-7yzf-nh5g figure 1 pin configuration p-tfbga-68 ( 4) top view, see the balls throught the package note: v ddl and v ssdl are power and ground for the dll.they are connected on the device to v dd and v ss - 0 0 4 ! 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